It is indispensable for the diffusion of IT machinery to supply stably high quality electronic parts and semiconductor devices. Morimura handles a wide range of electronic ceramic parts from main materials to subsidiary ones and prepares consistent systems of procurement and sale.
Leveraging the sophisticated expertise in the electronics and understanding the cutting-edge technology in the industry, we can provide total solutions of materials and processing products that meet customer’s needs.
We can supply lump size quartz and various type of silica powder from India, Sri Lanka, China, etc.
Applications: EMC filler for IC chips, refractory, industrial moldings, chemicals etc.
A stable supply structure has been established for Alumina based on the high production strength of Almatis which maintains production bases all over the world.
Silicon carbides offer excellent resistance against heat, corrosion and wear. Available in a range of grades applicable to sintered functional materials and the development of fine ceramics.
Used for water treatment materials, flame retardant paper, flame retardant filler for plastic compound resin , filler for artificial marble and various other applications.The Ceramics Division has coarse~fine products in our line up to fulfill many applications.
Zinc Borate is an inorganic flame retardant agent which suppress burning and smoke by insulating air and heat from your products with bubbles of crystal water, which is generated from Zinc Borate when it it burned, containing active components.
We can supply lumps and powder of feldspar.
Applications: CRT, frit, raw materials of ceramic
Berkshire Corporation is a U.S. manufacturer of wipers for clean rooms. The company was founded in the 1960s and is the oldest manufacturer for these products in the United States. Morimura is the Japanese agent for the product.
TOSOH zirconia powder TZ Series is produced through hydrolysis processes using advanced nanotechnologies.
Photoneece and Semicofine are high-heat resistance polyimide coatings that TORAY Industries, Inc. developed by taking full advantage of the technology for polyimide high-heat resistance resins the company cultivated over the years.
Toray Adhesive sheet for Semiconductor and Electronic Components have excellent performance and longtime experience in the application of the heat sink and stiffener attachment for the T-BGA and E-BGA as well as die bonding for various advanced packages.